The Snapdragon 8 Gen 4, Qualcomm’s upcoming flagship chipset, is making headlines again, this time with leaked specs that have the tech world buzzing.
A datasheet shared by SmartPrix reveals not one, but two versions of the chip: the standard SM8750 and a souped-up SM8750P, rumored to be reserved for Samsung’s Galaxy S25 Ultra.
Both variants are built on TSMC’s cutting-edge 3nm process, promising a boost in both performance and power efficiency. The standout feature? Qualcomm’s custom Oryon CPU cores, previously only seen in high-performance laptops. These cores, along with a powerful Adreno 830 GPU, Qualcomm’s Spectra ISP, and the FastConnect 7900 modem with Wi-Fi 7 and Bluetooth 5.4 support, make for a seriously impressive package.
While benchmark results suggest a modest performance improvement over the current Snapdragon 8 Gen 3, the Gen 4 is shaping up to be a lean, mean, power-sipping machine.
Expect to see this beast powering the next wave of flagship phones from brands like Asus, Honor, OnePlus, Oppo, Vivo,and Xiaomi as early as Q4 2024. Get ready for a new era of mobile performance and efficiency!
