Phones and tablets are getting ever so thinner, but there’s a gaping hole (literally) that’s really limiting the extent of how thin a phone can be – the headphone jack. Apple is looking to solve this problem with its new patent.
According to AppleInsider, Apple has filed for a patent (back in 2011, actually) for a new plug to be used with super-thin devices, possibly an indication to the future direction iPhones are heading into. The plug is D-shaped, saving some precious real estate that enables devices to have a thinner profile than the current generation of headphone jacks allow.
If it’s going to be implemented, it’s very likely to stir a lot of controversy, considering how universal the the 3.5mm and 2.5mm jacks are – but there’s always the market for adapter plugs until the markets adjust, just as they have done with Lightning connectors.
Source: AppleInsider
